[Introduction]: 1, BGA3600 integrated structure design,can repair different sizes of BGA, QFP, CSP etc)2, BGA3600 mainly include accurate Optical Position and Pick & place System, Dark IRReflow Soldering System, Software Control System, Visional Inspection System. [Optical Position and Pick & place System:]: |
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A, High precision linear guiderail and turning platform can realize X-Y-Z direction and Nozzle adjust by Φ angle (360C) and four dimensionsB, CCD, optical device and soft color splitting technology is composed of high precision optical mounting system, which can directly observe PCB pad and chip PIN foot overlap, position accurately and easy to operate, Max BGA size that can be mount is 70*70mmC, High-fi CCD camera provides dual output signals of PAL and VGA, has amplifying, micro-adjust,focus automatically, software operation function, software operating functions, image BGA chip and PCB on LCD with 30X optical zoom.D, BGA3600 mounting accuracy is ±0.02mm.[Dark IR Reflow Soldering System]: BGA3600 uses up and down back dark IR heating system, dark IR reflow soldering features as follows:1. Rework table doesn’t use infrared ordinary but dark IR, wavelength is strictly controlled in 2-8 micron, any color of the objects almost fully absorb IR in the range of wavelength2. Rework is different from reflow, it is processed for a single component, there is no masking phenomenon. It features high thermal efficiency, no air disturbance, which particularly is suitable for repair work, especially BGA rework. [Software Control System]:1, High precision welding system: de-soldering and welding process is controlled by computer software automatically, limitless different of set temperature can be stored in the computer according to the specific requirements of welding technology curve and BGA rework curve.2,Each technical curve can achieve the temperature curve simulations (40 segments temperature curve control) to improve the quality of welding. At the same time, two temperature probes, one for temperature measurement and control of the heating region, and the other can be stick on the welded components to test the actual temperature for the amendments to the temperature value of the heating region3, Reflow soldering temperature profile generated automatically and stored in the computer, they can call at any time. LCD screen displays real-time temperature curve. Also shows two sets of temperature values and working time.4, High-quality PC (Windows XP) system and BGA rework station system software, you can set reflow parameters according to the component characteristics. | | Welding Visional Inspection System:Uses Industrial camera to monitor the whole technical process of reflow soldering on BGA rework, you can see the solder ball melting process clearly for setting welding curve better to improve welding quality effectively. Spare Part and AccessoriesPC, BGA re-balling station, BGA template, Solder Ball, Flux solder, De-soldering wick, Clear Solution, Forceps. | Model | BGA3600 | Total power | 2000W | Hot Air heating at top | 800W | Dark IR preheating | 1200W | Working voltage | 220V(50Hz) | Control mode | Manual/automatic/programme | Mounting Accuracy | +/0.02mm | Position system | Double color soft light splitting technology | PCB size | Max:400*300mmMin:30*10mm | PCB thikness | 0.5-3mm | Software control system | Based on WINDODS control software | Mounting component size | Max:70*70mmMin:1*1mm | Pick-up strength | 2.0N | Temperature control system | Intelligent K type temperature control system,closed loop control | PCB transmission | Software control, move automatically | PCB driving system | High precision guiderail | Technical curve | 40 segments temperature control | Inspection system | YES | Weight | About 50kg | Size | 1100*720*620mm | Spare part and accessories:BGA re-balling station 1(standard)Vacuum pan 1 (optional)BGA template Different BGA shall be customizeFlux solder 1 tin/ 100g (standard)De-soldering Wicks 1 (standard)Clear solution 1 box (standard) |
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